Two-component silicon potting sealant

Two-component addition-curing potting adhesives are high-performance materials formed by thoroughly mixing two liquid components A and B in a 1:1 weight ratio, which undergo cross-linking through an addition reaction to cure. They can cure at room temperature or with heat to accelerate curing, during which there is minimal shrinkage and no significant temperature rise from the reaction. The cured adhesive exhibits excellent electrical properties, resistance to aging, and tolerance to extreme temperatures (ranging from -60°C to 200°C). It is waterproof and moisture-resistant, cures well in deep sections, and does not corrode contacting materials or pollute the surrounding environment. The two most prominent features are its thermal conductivity and flame retardancy, with its curing speed being significantly influenced by temperature.